Description
1 Piece
Mfr Package Description | 0.600 INCH, CERAMIC, DIP-28 |
Status | Discontinued |
Sub Category | SRAMs |
Access Time-Max | 45.0 ns |
I/O Type | COMMON |
JESD-30 Code | R-CDIP-T28 |
JESD-609 Code | e0 |
Memory Density | 65536.0 bit |
Memory IC Type | STANDARD SRAM |
Memory Width | 8 |
Number of Functions | 1 |
Number of Ports | 1 |
Number of Terminals | 28 |
Number of Words | 8192.0 words |
Number of Words Code | 8K |
Operating Mode | ASYNCHRONOUS |
Operating Temperature-Min | 0.0 Cel |
Operating Temperature-Max | 70.0 Cel |
Organization | 8KX8 |
Output Characteristics | 3-STATE |
Output Enable | YES |
Package Body Material | CERAMIC, METAL-SEALED COFIRED |
Package Code | DIP |
Package Equivalence Code | DIP28,.6 |
Package Shape | RECTANGULAR |
Package Style | IN-LINE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Qualification Status | Not Qualified |
Seated Height-Max | 5.84 mm |
Standby Current-Max | 0.001 Amp |
Standby Voltage-Min | 4.5 V |
Supply Current-Max | 0.09 Amp |
Supply Voltage-Nom (Vsup) | 5.0 V |
Supply Voltage-Min (Vsup) | 4.5 V |
Supply Voltage-Max (Vsup) | 5.5 V |
Surface Mount | NO |
Technology | CMOS |
Temperature Grade | COMMERCIAL |
Terminal Finish | Tin/Lead (Sn/Pb) |
Terminal Form | THROUGH-HOLE |
Terminal Pitch | 2.54 mm |
Terminal Position | DUAL |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Length | 37.145 mm |
Width | 15.24 mm |
These came to us as part of a lot of surplus stock from a large Milspec type OEM and have been kept in storage for some years, we have therefore classified them as ‘new other’. They are however unused and in pristine condition and as with all our products come with a full guarantee. The photograph’s are of the actual chips we hold in stock.
For datasheet search….MCM6164C45
WE PURCHASE SURPLUS ELECTRONIC COMPONENTS AND EQUIPMENT!