Description
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1 Piece
Advanced Micro Devices (AMD )
Ceramic ‘Milspec’ J suffix CDIP16 PACKAGE
SPECIFICATIONS
Mfr Package Description | CERAMIC, DIP-16 |
Status | Discontinued |
Sub Category | OTP ROMs |
Access Time-Max | 60.0 ns |
JESD-30 Code | R-GDIP-T16 |
JESD-609 Code | e0 |
Memory Density | 2048.0 bit |
Memory IC Type | OTP ROM |
Memory Width | 4 |
Number of Functions | 1 |
Number of Terminals | 16 |
Number of Words | 512.0 words |
Number of Words Code | 512 |
Operating Mode | ASYNCHRONOUS |
Operating Temperature-Min | -55.0 Cel |
Operating Temperature-Max | 125.0 Cel |
Organization | 512X4 |
Output Characteristics | 3-STATE |
Package Body Material | CERAMIC, GLASS-SEALED |
Package Code | DIP |
Package Equivalence Code | DIP16,.3 |
Package Shape | RECTANGULAR |
Package Style | IN-LINE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Qualification Status | Not Qualified |
Screening Level | 38535Q/M;38534H;883B |
Seated Height-Max | 5.08 mm |
Supply Voltage-Nom (Vsup) | 5.0 V |
Supply Voltage-Min (Vsup) | 4.5 V |
Supply Voltage-Max (Vsup) | 5.5 V |
Surface Mount | NO |
Technology | BIPOLAR |
Temperature Grade | MILITARY |
Terminal Finish | Tin/Lead (Sn/Pb) |
Terminal Form | THROUGH-HOLE |
Terminal Pitch | 2.54 mm |
Terminal Position | DUAL |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Length | 19.431 mm |
Width | 7.62 mm |
IF FURTHER SPECIFICATIONS REQUIRED SEARCH….AMD AM27S13/BEA
These parts came to us as part of a lot of surplus stock from a large Milspec type OEM and have been kept in storage for some time (date coded 8804), we have therefore classified them as ‘new other’. They are however unused and in pristine condition, stored with us still tubed and in original packaging, and, as with all our products they come with a full guarantee. The photograph’s are of the actual chips we hold in stock.
PLEASE NOTE!
If you have similar items to this, or indeed any electronic components that are surplus to requirements please contact us with details.